Fabless65Foundry16Memory22Networking59Optics48Semicap61Materials81Integration70DC Infra106Robotics75AI Cloud20AI Model5
/
Industry
Materials / Consumables
Wafers, substrates, chemicals, gases, ceramics, and other inputs consumed by fabs and packaging lines.
81Companies6Segments15Shown
Packaging - 15 companiesSorted by market cap
009150.KSSamsung Electro-Mechanics Co., Ltd.Packaging$69.0BKSC·KR
4062.TIbiden Co., Ltd.Packaging$33.8BJPX·JP
6971.TKyocera CorporationPackaging$29.5BJPX·JP
QQnity Electronics, Inc.Packaging$27.6BNYSE·US
4004.TResonac Holdings CorporationPackaging$18.3BJPX·JP
6988.TNitto Denko CorporationPackaging$14.3BJPX·JP
011070.KSLG Innotek Co., Ltd.Packaging$9.4BKSC·KR
002436.SZShenzhen Fastprint Circuit Tech Co., Ltd.Packaging$8.9BSHZ·CN
4203.TSumitomo Bakelite Company LimitedPackaging$4.0BJPX·JP
353200.KSDaeduck Electronics Co., Ltd.Packaging$3.7BKSC·KR
4626.TTaiyo Holdings Co., Ltd.Packaging$3.3BJPX·JP
ROGRogers CorporationPackaging$2.3BNYSE·US
4208.TUBE CorporationPackaging$2.2BJPX·JP
4272.TNippon Kayaku Co., Ltd.Packaging$1.9BJPX·JP
4971.TMEC Company Ltd.Packaging$0.8BJPX·JP